ʻOihana Mini/Micro LED i ka makahiki 2024: He moʻolelo o nā waiwai like ʻole i waena o ka hoʻopukapuka kālā nui (5)
Ma waho aʻe o ke kālele ʻana i nā ʻenehana makua i hoʻokumu ʻia a hoʻokele ʻia e ka ʻaelike, ua ʻimi nā mea hana i ka makahiki 2024 i nā ʻāina i ʻike ʻole ʻia ma Led liʻiliʻi ʻenehana. Inā paha e lilo kēia mau ʻano hana ʻoi loa i ke kī i ka hoʻoponopono ʻana i nā pilikia e like me ka emi ʻana o nā hopena quantum, nā helu kīnā, a me nā pilikia kaʻina hana nui ma Micro LED, he kumuhana ia e pono ai ka nānā mau ʻana.
I ka pūnāwai o 2024, ua hoʻolaha ʻo Xuxian Future i kahi hōʻike pale nui Micro LED 4K hou. Ua ʻōlelo ʻo ia e hoʻohana i ka ʻāpana kiʻi lahilahi Micro LED mua loa o ka honua (e wehe ana i ka substrate mua). ʻenehana MiPMa o ka hoʻoliʻiliʻi ʻana o nā ʻāpana, ka wehe ʻana i ka substrate mua, ka hoʻoili nui ʻana, a me ka hoʻopili ʻana o ka semiconductor fan-out a me nā ʻenehana hoʻāʻo, hoʻopili ia i ka ʻenehana Micro a me nā ʻāpana Micro-sized (30um ma kēlā me kēia ʻaoʻao) i nā huahana hōʻikeʻike i hana nui ʻia. ʻO ka hopena, ua lilo ka hoʻopili ʻana o ka substrate-free a me ka hanauna hou semiconductor-level i mau kumuhana wela i ka ʻenehana Micro LED.
I ka makahiki 2024, ma ke kumu o ka hoʻokō ʻana i ka hana hoʻāʻo liʻiliʻi o ke aniani i hoʻokele ʻia e PM Hōʻikeʻike LED liʻiliʻinā panela, ua ʻimi ikaika ʻo Lehman Optoelectronics a hoʻomaikaʻi i ka ʻenehana aniani. Ua kūkulu lākou i kahi pale pale patent a puni ka ʻenehana aniani a hoʻolaha ikaika i ke kūkulu ʻana i kahi kahua hana hoʻāʻo. ʻOi aku ka maikaʻi o ke ala hana aniani PM no ka hoʻoili nui ʻana a ʻaʻole pono i nā kumuwaiwai TFT kiʻekiʻe.
I ka waena o 2024, ua hōʻike ʻo Qiushui Semiconductor i kahi ʻenehana kukui uila Micro LED hybrid 8-'īniha i hoʻopaʻa ʻia a ʻaʻole luku. Hoʻohana hou kēia ʻenehana i kahi ʻano insulation uila ma kahi o kahi ʻano insulation kino, e hoʻokō ana i ka hoʻokaʻawale uila o kēlā me kēia kiko pixel me ka ʻole o ka hōʻino kino. Manaʻo ʻia e hoʻolauna i kahi module kukui uila kaʻa digital 0.61-'īniha i ka makahiki 2025. ʻO ka ʻenehana Hybrid-bonding, kahi ʻenehana kaulana i ke kahua semiconductor, i ka wā e hoʻopili ʻia ai i ka ʻāpana chip Micro LED, hiki ke lawe mai i kahi hoʻolālā hoʻohui heterogeneous multi-layer a me multi-color. Ma ke ʻano he mea hou ʻenehana hōʻike liʻiliʻi, pehea e hoʻopilikia ai i ka hoʻomohala ʻana o ka ʻenehana Micro LED i ka wā e hiki mai ana he kumu kuhikuhi nui ia i ka ʻoihana.
Ma waho aʻe o kēia mau hihia, ke puka mai nei nā hana hou i loko o kahi kahawai pau ʻole i loko o ke kaulahao ʻoihana o nā noi Micro LED, me nā mea hana, nā kaʻina hana, nā lako hoʻohui, ka nānā ʻana, a me nā ʻenehana hoʻoponopono. Kuhikuhi nā mea kūloko o ka ʻoihana i ka nani o LED liʻiliʻiʻaʻole wale ia ma kāna uhi noi piha a me ka hana hōʻike maikaʻi loa akā ma ka hiki palena ʻole i hāʻawi ʻia e kāna mau ala ʻenehana like ʻole. Pehea e hoʻohui ai i nā manaʻo hou aʻe, a me nā mea hana, nā kaʻina hana, a me nā ʻenehana mai nā kahua ākea me Micro LED, ʻo ia ka mea hoʻokele nui loa no ka hoʻomohala mau ʻana o ka ʻoihana.
