Funda ngesizukulwana esilandelayo sobuchwepheshe bokubonisa obuqhelekileyo - iMicro-LED

Kule mihla, iteknoloji yokubonisa ibe yindlela ephambili yokutshintshiselana ngolwazi, igubungela ii-smartphones, izixhobo ze-VR/AR, iimveliso ezinxitywayo, iziboniso ezisemotweni, iitablets/iikhompyutha kunye nokuboniswa kwe-laser.

 

I-Micro LEDItekhnoloji yaziwa ngokuba yi "teknoloji yokubonisa yesizukulwana esilandelayo", uphuhliso lwayo kunye nophuhliso lwemizi-mveliso luyakhawuleza, kwaye amathuba emarike ayanda.

Uyilo lwamashishini aphambili asekhaya

 

I-Tianma Microelectronics ibisoloko ityale imali kwitekhnoloji ye-Micro-LED ukusukela ngo-2017, igxile kwi-PPI ephezulu, ukukhanya okuphezulu kunye nokukhanya okuphezulu. iziboniso zokubonakalaLe nkampani iqalise inani leemveliso zeMicro-LED eziphambili kushishino.

 

Ngowama-2022, iTianma yatyala imali ekwakhiweni komgca wemveliso weMicro-LED osebenza ngokupheleleyo ukusuka ekudluliseleni okukhulu ukuya kwimodyuli yokubonisa, isebenzisa inkqubo yelaser kunye nezixhobo ezenziwe ngokwezifiso, kwimeko yokungabikho kwetekhnoloji ethengiswayo kwihlabathi liphela, ukufezekisa imveliso ezenzekelayo ngokupheleleyo. Lo mgca waphumelela ukuvelisa imveliso yawo yokuqala ngoJuni 26, 2024, apho izixhobo zokuvelisa ezingaphezu kwama-30 kunye nezixhobo zaphuhliswa ngokubambisana neenkampani zokuhambisa.

Ngomhla wama-31 kweyoMqungu, i-BOE Huacan Optoelectronics Zhuhai I-Micro LED Iprojekthi yokuvelisa iiwafer kunye novavanyo lokupakisha igqityiwe, le projekthi igubungela indawo emalunga neehektare ezingama-217, utyalo-mali olumalunga neebhiliyoni ezi-2 zeeyuan, iza kukhanyisa imveliso yokuqala ngoSeptemba 2024, ecwangciselwe ukuveliswa ngobuninzi ngoDisemba kulo nyaka, ikamva liza kufezekisa imveliso yonyaka ye-58,800I-Micro LEDiiwafers.

Ngokwedatha, ubungakanani bemarike yeetships zeMicro LED ngo-2023 bumalunga nezigidi ezingama-32 zeerandi zaseMelika, kwaye kulindeleke ukuba ubungakanani bemarike yeMicro LED yehlabathi ngo-2025 budlule kwi-3.5 yeebhiliyoni zeerandi zaseMelika ngo-2025, kwaye kulindeleke ukuba idlule ngaphezulu kwi-10 yeebhiliyoni zeerandi zaseMelika ngo-2027.

 

I-Micro-LED- isizukulwana esilandelayo sobuchwepheshe bokubonisa obuqhelekileyo

 

I-Micro-LED, eyaziwa ngokuba yi-mLED okanye i-μLED, sisixhobo esenziwe ngeeyunithi ze-electroluminescence zesikali se-micron. Ngokusebenzisa iteknoloji yokudlulisa ubunzima, ezi yunithi zinokudluliselwa kwi-substrate eqinileyo okanye eguquguqukayo zize zipakishwe ngeeleya zokukhusela kunye nee-electrode.

Umgaqo wokubonisa we-Micro-LED

 

Isiseko setekhnoloji yeMicroLED sikwisakhiwo sayo see-pixel, i-pixel nganye yenziwe ngee-sub-pixels ezinombala obomvu, oluhlaza, noluhlaza okwesibhakabhaka. I-sub-pixel nganye inokulawulwa ngokuzimeleyo ukuze ilungise ngokuchanekileyo ukukhanya, umbala kunye nomahluko wesiboniso. Kwinkqubo yesiboniso seMicroLED, ukukhanya okukhutshwa yi-LED nganye kucutshungulwa yilensi kunye nesipili, kwaye ekugqibeleni kwakheka ii-pixels kwisikrini sesiboniso, kwaye kulungiswa yisihluzo sombala ukubonisa ukusebenza kombala okufunwayo. Inzuzo yale teknoloji kukukwazi kwayo ukubonelela ngokukhanya okuphezulu kakhulu, umahluko kunye nokuchaneka kombala.

 

Ngaphezu koko, iMicro I-LEDI-array iqhagamshelwe kwiipali ezilungileyo nezingalunganga ze-Micro LED nganye ngee-electrode zegridi ezilungileyo nezingalunganga ezicwangciswe ngokuthe nkqo. Olu qhagamshelo lwenza i-Micro LED ikhanyiswe ngokuskena ngokusebenzisa imigca ye-electrode ngokulandelelana okuthile, ngaloo ndlela ifezekisa ukuboniswa komfanekiso.

Inkqubo ye-Micro-LED

 

I-Micro-LED sisakhiwo se-LED esicutshungulwa ngefilimu encinci, i-miniaturization kunye ne-array, kwaye ubukhulu bayo bumalunga ne-1-100μm. Le ndlela ibandakanya ukudlulisela ii-micro-LEDs ngeebhetshi kwiibhodi zesekethe, ezinokuba nzima okanye zithambile, zicace okanye zingacaci. Okulandelayo, inkqubo yokufaka izinto emzimbeni isetyenziselwa ukongeza umaleko okhuselayo kunye ne-electrode ephezulu, kwaye ekugqibeleni i-substrate ephezulu ipakishwe ukwenza isiboniso se-Micro-LED.

Izibonisi ze-Micro-LED zahlukile ngokupheleleyo kwizibonisi ze-LED zemveli ngokweengqolowa, iphakheji, inkqubo yokudibanisa, i-backplane kunye ne-drive.

 

Inkqubo yokuvelisa i-Micro-LED ibandakanya ikakhulu:

 

Okokuqala, ikristale ye-LED incinci, incinci kwaye ilungelelaniswe ngetekhnoloji yenkqubo yokwenziwa kwezinto ezincinci.

Okwangoku, inkqubo yokunciphisa ii-semiconductors kunye neetships isondela kumda wayo, kodwa inkqubo yeMicro-LED isenendawo enkulu yokukhula. Kukho iindlela ezintathu eziphambili ezisetyenziswayo: ukuwelda kwinqanaba le-chip, ukuwelda kwinqanaba le-epitaxial kunye nokudluliselwa kwefilimu.

 

Ukubopha itshiphu (ukubopha itshiphu kwinqanaba letshiphu)

 

Ukuwelda kwinqanaba le-chip kubandakanya ukwahlula i-LED ibe zii-micron-scale Micro LED chips kunye nokuzibophelela kwibhodi yokubonisa kusetyenziswa itekhnoloji ye-SMT okanye ye-COB. Le ndlela inokulungisa isithuba sokudlulisa, kodwa ayinakudluliselwa ngeebhetshi.

 

I-SMT isetyenziswa kakhulu kwicandelo lokuhlanganisa nge-elektroniki, ngokufaka izinto ze-chip kwi-PCB okanye kwezinye iindawo ezingaphantsi komhlaba, kusetyenziswa iindlela zokufaka i-reflow welding okanye i-dip welding ezifana ne-welding assembly. Amanyathelo aquka ukuhlolwa kwezinto, ukuncamathisela isikrini, ukupeyinta, ukomisa, ukutshiza kwakhona, ukucoca, ukufaka i-plug-in, ukutshiza ngamaza, ukucoca kwakhona, ukuhlola kunye nokulungisa.

 

I-COB yiteknoloji yokubonisa encinci ehlanganisa ngokuthe ngqo ii-wafers ze-LED kwi-PCB kwaye izidibanise zibe ziiyunithi ze-CELL. Xa kuthelekiswa netekhnoloji ye-SMD, itekhnoloji yokupakisha ye-COB ineenzuzo zayo ezikhethekileyo.

I-wafer bonding (ukuwelda kwe-epitaxial)

 

Ukuwelda kwinqanaba le-Epitaxial yindlela yokwenza ngokuthe ngqo isakhiwo sefilimu esincinci se-micrometer se-Micro-LED epitaxial kwi-LED epitaxial thin film layer ngetekhnoloji ye-plasma ion etching (ICP) edibeneyo nge-inductively. Isithuba esimiselweyo sesi sakhiwo sisithuba esifunekayo see-pixels zokubonisa.

 

Emva koko, i-wafer ye-LED equlathe umaleko we-epitaxial kunye ne-substrate iqhagamshelwe ngqo kwibhodi yesekethe ye-drive, kwaye i-substrate ihlulwe kusetyenziswa indlela ebonakalayo okanye yekhemikhali, kushiyeke kuphela isakhiwo sefilimu ye-epitaxial ye-Micro-LED eyi-4 ukuya kwi-5μm ukwenza i-pixel yokubonisa kwibhodi yesekethe ye-drive. Inzuzo yale ndlela kukuba ukudluliselwa kwebhetshi kunokufezekiswa, kodwa ingxaki kukuba ixesha lokudluliselwa alinakulungiswa.

Ukuhanjiswa kwefilimu encinci Ukuhanjiswa kwefilimu encinci

 

I-substrate ye-LED isuswa ngeendlela ezibonakalayo okanye zeekhemikhali, kusetyenziswa i-substrate yexeshana ukubamba umaleko wefilimu ye-Micro-LED. Emva koko, isakhiwo se-micron senziwe ngokugrumba kwe-plasma edibeneyo. Enye indlela kukuqala ngokugrumba uze emva koko ukhuphe i-substrate ye-LED. Ngokwemfuno yesithuba sendawo yokubonisa kwisekethe yokuqhuba, ifilimu ye-Micro-LED ifuduselwa kwibhodi yomqhubi ngeebhetshi ngesixhobo sokudlulisa esikhethiweyo ukuze kugqitywe ukuhlanganiswa kwe-display point. Le nkqubo ibiza kancinci, ayithintelwanga bubungakanani bebhodi yokubonisa, kwaye ingadluliselwa ngomlinganiselo omkhulu.

 

Okwesibini, ukudluliselwa kwebhetshi kwibhodi yesekethe - iteknoloji enkulu yokudluliselwa

 

Eyona nto iphambili kwitekhnoloji yeMicro-LED kukuhlanganiswa okuxineneyo kwezikhanyiso ezincinci kakhulu kwitshiphusi, nto leyo efuna inkqubo ekhethekileyo - itekhnoloji enkulu yokudlulisa ukukhanya (ekwabizwa ngokuba yitekhnoloji yokudlulisa ukukhanya okukhulu).

Le ndlela ibandakanya ukudityaniswa ngokuchanekileyo kwamakhulu ukuya kumawaka eenkozo ze-LED eziphambili kwibhodi yesekethe encinci ye-TFT, nto leyo efuna izinga eliphezulu kakhulu lokusilela. Nangona kukho ubuchwepheshe obahlukeneyo obuzama ukufezekisa le njongo, ukudluliselwa kobuninzi kuseyiteknoloji ekufuneka iveliswe ngobuninzi.

Iindlela zokudlulisa ubunzima zahlulwe zibe ziindidi ezine: ukuthabatha ngokuchanekileyo, ukuzihlanganisa, ukukhulula ngokukhetha, kunye nokudlulisa.

 

Ngenxa yokwanda kwemfuno yemarike yezikrini ezinemibala ephezulu nezinesisombululo esiphezulu, ukwenziwa kombala we-Micro-LED kube yinto ephambili kuphando. Okwangoku, iindlela eziphambili zokuphumeza ziqukaIndlela ye-RGB yemibala emithathu ye-LED, indlela ye-UV/blue LED ekhupha ukukhanya okuphakathi kunye nendlela yokwenziwa kwelensi ye-optical.

Njengoko imakethi ye-AR/VR iqhubeka nokukhula, kukho imfuno ekhulayo yeepaneli ezisebenza kakuhle ezingasakwaziyo ukuhlangabezana nezibonisi zemveli ze-LCD kunye ne-OLED. Imakethi ifuna ngokukhawuleza ubuchwepheshe obutsha bokubonisa ukuphucula ukusebenza kunye nokuhlangabezana nemigangatho yophuhliso lwexesha elizayo. Itekhnoloji ye-Micro-LED njengesisombululo esitsha, iimpawu zayo ziyenza ibe ngumncintiswano onamandla wokuhlangabezana nezi mfuno.